News
Avient Presented Additives For Flexible Packaging in Brazil
Avient was exhibiting at CONINFLEX, the International Flexible Packaging Congress, on June 25 – 28, 2024
Braskem Partners with TNO to Transform PO Residue Recycling
Both companies will advance the research and development of the state-of-the-art Möbius dissolution-based recycling technology for polyolefin plastic residue waste streams
Making possible maximum sorting performance
Sesotec presented the latest AI technologies NIR-Ai and OBJECT-Ai at IFAT 2024
Moldex3D and Xnovo Technology announce partnership
to offer advanced fiber analysis for accurate material data and 3D fiber orientation prediction